{"product_id":"pasta-flux-kslid-f60-60g","title":"Pasta Flux KSLid F60, 60g","description":"\u003c!DOCTYPE html PUBLIC \"-\/\/W3C\/\/DTD HTML 4.0 Transitional\/\/EN\" \"http:\/\/www.w3.org\/TR\/REC-html40\/loose.dtd\"\u003e\n\u003chtml\u003e\u003cbody\u003e\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cdiv class=\"text-editor-custom-title\"\u003ePasta Flux KSLid F60\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eLa pasta flux KSLid F60 è appositamente progettata per la riparazione delle schede madri dei telefoni, chip BGA e processori, basata su una\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e formula con colofonia ad alta purezza. La formula senza piombo e alogeni ha un basso livello di corrosione, contribuendo a proteggere \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003ei componenti di precisione e le tracce dei circuiti. La buona attività di saldatura aiuta a rimuovere rapidamente i film di ossido, \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003emigliora l'umidificazione della lega e riduce il rischio di ponti di saldatura o saldature fredde. La pasta produce poco fumo e ha\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e bassa volatilità, e i residui risultanti dopo il riscaldamento possono essere facilmente puliti. La consistenza fine e uniforme mantiene\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e l'umidità e non si asciuga rapidamente, risultando adatta per lavori di riparazione frequenti.\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cimg src=\"https:\/\/img.gsmnet.ro\/800X800\/products\/246429\/pasta-flux-kslid-f60-1-1788441605.png\" title=\"Pasta Flux KSLid F60, 60g \" alt=\"Pasta Flux KSLid F60, 60g \" class=\"text-editor-custom-img text-editor-custom-img-for-split\" style=\"width: 50%;\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cb\u003eCaratteristiche:\u003c\/b\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Contenuto netto: 60 g\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Formula con colofonia ad alta purezza\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Senza piombo e alogeni\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Basso livello di corrosione\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Adatta per schede madri di telefoni, chip BGA e processori\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Buona attività di saldatura\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Riduce il rischio di ponti di saldatura e saldature fredde\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Fumo e volatilità ridotti\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Residui facili da pulire\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Consistenza fine e uniforme\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003c\/div\u003e\u003c\/body\u003e\u003c\/html\u003e","brand":"KSLid","offers":[{"title":"Default Title","offer_id":58678948299084,"sku":"384538","price":3.84,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0833\/9102\/1388\/files\/pasta-flux-kslid-f60-1-1788441605.png?v=1788458893","url":"https:\/\/gsmnetshop.it\/products\/pasta-flux-kslid-f60-60g","provider":"GSMnet","version":"1.0","type":"link"}