{"product_id":"instrument-bga-sunshine-ss-101f","title":"BGA Tool Sunshine SS-101F","description":"\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\u003cdiv class=\"text-editor-custom-title\"\u003e\u0026nbsp;Sunshine SS-101F BGA Tool\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eThe Sunshine SS-101F tool is specially designed for precise adhesive removal and cleaning of BGA chips during delicate\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003erepairs on motherboards. The package includes a double ergonomic handle measuring 135 x 9 x 9 mm, non-slip and easy to handle due to its weight of only 47 grams,\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eequipped with a double cross chuck that ensures an extremely firm blade fixation. The 3 included interchangeable blades are hand-polished\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eto an ultra-thin thickness of 0.4 mm, allowing you to remove resin, adhesive, or disassemble chips and the die\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003ewithout damaging fine traces or neighboring components.\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cimg src=\"https:\/\/img.gsmnet.ro\/800X800\/products\/248318\/instrument-bga-sunshine-ss-101f-1-1791531376.jpg\" title=\"instrument-bga-sunshine-ss-101f-\" alt=\"instrument-bga-sunshine-ss-101f-\" class=\"text-editor-custom-img text-editor-custom-img-for-split\" style=\"width: 50%;\"\u003e\u003c\/div\u003e","brand":"Sunshine","offers":[{"title":"Default Title","offer_id":59107485647180,"sku":"386427","price":7.55,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0833\/9102\/1388\/files\/instrument-bga-sunshine-ss-101f-1-1791531376.jpg?v=1791531744","url":"https:\/\/gsmnetshop.it\/en\/products\/bga-tool-sunshine-ss-101f","provider":"GSMnet","version":"1.0","type":"link"}